|
[1-1] K. Nakatsu and R. Saito, “The next-generation high power density inverter technology for vehicle,” 2014 International Power Electronics Conference (IPEC-Hiroshima 2014 - ECCE ASIA), 2014, pp. 1925-1928. doi: 10.1109/IPEC.2014.6869850. [1-2] X. Wen, T. Fan, P. Ning and Q. Guo, “Technical approaches towards ultra-high power density SiC inverter in electric vehicle applications,” CES Transactions on Electrical Machines and Systems, vol. 1, pp. 231-237, 2017. doi: 10.23919/TEMS.2017.8086101. [1-3] M. Östling, R. Ghandi and C. Zetterling, “SiC power devices — Present status, applications and future perspective,” 2011 IEEE 23rd International Symposium on Power Semiconductor Devices and ICs, 2011, pp. 10-15. doi: 10.1109/ISPSD.2011.5890778 . [1-4] J. Biela, M. Schweizer, S. Waffler and J. W. Kolar, “SiC versus Si—Evaluation of Potentials for Performance Improvement of Inverter and DC–DC Converter Systems by SiC Power Semiconductors,” IEEE Transactions on Industrial Electronics 58 (2011) 2872. doi: 10.1109/TIE.2010.2072896. [1-5] 顏誠廷, “碳化矽功率半導體元件,” 《電子資訊》功率電子專刊,第 20 卷,第 1 期 ,2014 年 6 月。 [2-1] C.-M. Zetterling, Process Technology for Silicon Carbide Devices, London, United Kingdom: INSPEC, 2002. [2-2] 張煒旭、黃宇中、林稔杰, “單晶碳化矽在微電子及微感測元件之應用,” 《科儀新知》,第 24 卷,第 4 期 ,4-14頁,2003 年 2 月。 [2-3] B. Razavi,“microelectronics”John Wiley & Sons (Asia) Pte Ltd, p.255. [2-4] https://www.youtube.com/watch?v=SjxVE0oZlL4 [2-5] R. K. Williams, M. N. Darwish, R. A. Blanchard, R. Siemieniec, P. Rutter and Y. Kawaguchi, “The Trench Power MOSFET: Part I—History, Technology, and Prospects,” IEEE Transactions on Electron Devices 64 (2017) 674-691. doi: 10.1109/TED.2017.2653239. [4-1] NVHL080N120SC1 MOSFET - SiC Power, Single N-Channel 1200 V, 80 m, 31 A https://www.onsemi.com/products/wide-bandgap/silicon-carbide-sic-mosfets/nvhl080n120sc1?_ga=2.80477207.1471916401.1624520596-1827983697.1624520596 [4-2] Muhammad Nawaz, "On the Evaluation of Gate Dielectrics for 4H-SiC Based Power MOSFETs", Active and Passive Electronic Components, vol. 2015, Article ID 651527, 12 pages, 2015. https://www.hindawi.com/journals/apec/2015/651527/ [4-3] P. Vudumula and S. Kotamraju, "Design and Optimization of SiC Super-Junction MOSFET Using Vertical Variation Doping Profile," in IEEE Transactions on Electron Devices, vol. 66, no. 3, pp. 1402-1408, March 2019, doi: 10.1109/TED.2019.2894650. https://ieeexplore.ieee.org/abstract/document/8634918 [4-4] 潘彥廷,「功率半導體元件之解構與模擬」,東華大學,碩士論文,民國一百一十年。 |